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Each member of our design team has upwards of
20 years experience in the electronic packaging
industry. Each brings a wealth of knowledge and
a unique background to the project, enabling us to
offer a broad spectrum of engineering support
services to our clients.
High Speed Design
Impedance awareness
Timing constraints
Crosstalk analysis
EMC Compliance
(Electro-Magnetic Compatibility)
Digital/Analog Design
High Density Placements
(SMT/High layer counts/double-sided)
Highly constrained routing
BGA Technology
High/Low Speed Analog
Mixed Signal
Design Engineering/R&D
PCB bare board manufacture,
prototype and production runs
PCB assembly, prototype and
production runs
Documentation Control
Design Verification
Design Flow Consulting
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Power Supplies
Flex Circuit Design
RF Design
Military Application
Mil Spec
Hybrid Design
MCM Design
DFM (Design for Manufacture)
Layout Verification
Artwork verfication
IPC Standard Netlist Verification
Testability
Cost Reduction - Specialize
Constraint Minimization
Layer count reduction
Legacy Database Restoration
CAD Drafting
Process Control Consulting
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